EB3250JA12-24.000M TR 数据手册
EB3250 Series
REGULATORY COMPLIANCE
2011/65 +
2015/863
191 SVHC
ITEM DESCRIPTION
Automotive Grade Quartz Crystal Resonator 3.2mm x 5.0mm x 0.85mm 4 Pad Ceramic Surface Mount (SMD)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
7.6MHz to 54MHz
Frequency Tolerance/Stability
±50ppm at 25°C, ±100ppm over -40°C to +85°C
±30ppm at 25°C, ±50ppm over -40°C to +85°C
±15ppm at 25°C, ±30ppm over -40°C to +85°C
±15ppm at 25°C, ±20ppm over -40°C to +85°C
±10ppm at 25°C, ±20ppm over -40°C to +85°C
±50ppm at 25°C, ±100ppm over -40°C to +105°C
±30ppm at 25°C, ±50ppm over -40°C to +105°C
±50ppm at 25°C, ±100ppm over -40°C to +125°C
±30ppm at 25°C, ±50ppm over -40°C to +125°C
±3ppm/year Maximum
Aging at 25°C
Load Capacitance
Shunt Capacitance
Equivalent Series Resistance
Series Resonant,
8pF Parallel Resonant to 32pF Parallel Resonant
5pF Maximum
Mode of Operation
100 Ohms Maximum over Nominal Frequency of 7.6MHz to 11.999999MHz
60 Ohms Maximum over Nominal Frequency of 12MHz to 13.999999MHz
50 Ohms Maximum over Nominal Frequency of 14MHz to 19.999999MHz
40 Ohms Maximum over Nominal Frequency of 20MHz to 54MHz
AT-Cut Fundamental
Drive Level
300µWatts Maximum
Crystal Cut
AT-Cut
Spurious Response
Measured from Fo to Fo +5000ppm
-3dB Minimum
-50°C to +150°C
Storage Temperature Range
Insulation Resistance
Measured at 100Vdc
500 Megaohms Minimum
Revised A: 5/18/2018
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EB3250 Series
PART NUMBERING GUIDE
Revised A: 5/18/2018
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EB3250 Series
MECHANICAL DIMENSIONS
SUGGESTED SOLDER PAD LAYOUT
PIN
1
CONNECTION
Crystal
2
Cover/Ground
3
Crystal
4
Cover/Ground
All Tolerances are ±0.1
All Dimensions in Millimeters
Revised A: 5/18/2018
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EB3250 Series
TAPE & REEL DIMENSIONS
Quantity per Reel: 1,000 Units
All Dimensions in Millimeters
Compliant to EIA-481
Revised A: 5/18/2018
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EB3250 Series
RECOMMENDED SOLDER REFLOW METHOD
HIGH TEMPERATURE INFRARED/CONVECTION
TS MAX to TL (Ramp-up Rate)
3°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum(TS MAX)
- Time (ts MIN)
Ramp-up Rate (TL to TP)
150°C
175°C
200°C
60 - 180 Seconds
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
217°C
60 - 150 Seconds
Target Peak Temperature(TP Target)
250°C +0/-5°C
Time within 5°C of actual peak (tp)
20 - 40 Seconds
Ramp-down Rate
6°C/Second Maximum
Time 25°C to Peak Temperature (t)
8 Minutes Maximum
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
3°C/Second Maximum
260°C Maximum for 10 Seconds Maximum
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
Revised A: 5/18/2018
Page 6 of 10
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EB3250 Series
RECOMMENDED SOLDER REFLOW METHOD
LOW TEMPERATURE INFRARED/CONVECTION
TS MAX to TL (Ramp-up Rate)
5°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum(TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
N/A
150°C
N/A
30 - 60 Seconds
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
150°C
200 Seconds Maximum
Target Peak Temperature(TP Target)
245°C Maximum 2 Times/230˚C Maximum 1Time
Time within 5°C of actual peak (tP)
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
Ramp-down Rate
5°C/Second Maximum
Time 25°C to Peak Temperature (t)
N/A
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
5°C/Second Maximum
245°C Maximum
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
Revised A: 5/18/2018
Page 7 of 10
www.ecliptek.com
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